PCB Assembly Technical Capabilities
| Category | Description | Capability |
| File Formats | Gerber files(preferred), AutoCAD, DWG | 274-X,274-D, DXF, … |
| BOM (Bill of Materials) | Excel(preferred), PDF | |
| Pick and Place file (XYRS) | X & Y coordinates | |
| Board type | Board types for assembly | Rigid, Flexible, Rigid-Flex |
| Board Size | Minimum and Maximum | Smallest size: 2.0” x 2.0”, 50mm x 50mm Largest size: 19.7” x 19.7”, 500mm x 500mm |
| Solder paste printing | Max stencil size | 1560mm x 450mm |
| Pick and Place | Min. SMT part package | 0201 |
| Min. IC pitch | 0.3mm | |
| Min.chip size | 01 005 | |
| QFP lead pitch | 0.38mm to 2.54mm | |
| BGA capability | BGA ball pitch | 0.5mm to 3.00 mm |
| BGA ball size | 0.4mm to 1.0mm | |
| Reballing and Rework (De-population and Re-population) | ||
| Reflow | Optimized Reflow Profiling and multi-zone temperature control | |
| Wave flow | temperature control and tooling | |
| Assembly and builds | Press Fit Connectors | Yes |
| Mechanical Assembly and Box Builds | Yes | |
| Cable & Harness Assembly | Yes | |
| Rework | De-population and Re-population | Yes |
| Fine Pitch | Yes | |
| Cuts & Jumps | Yes | |
| Minor PCB Repair | Yes | |
| Wash | De-ionized Wash | Yes |
| Testing | Visual Inspection | Yes |
| AOI (Automated Optical Inspection) | Yes | |
| ICT (In Circuit Test) | Yes | |
| X-Ray | Yes | |
| Functional Test | Yes | |
| Firmware loading | Yes | |