| Item |
Mass production |
Small batch production |
| Number of layers |
UP to16L |
UP to 30L |
| Laminate |
FR-4, Halogen free, High TG, Cem-3, PTFE, Aluminum BT, Rogers |
| Maximum board size |
610*460mm |
728*1100mm |
| Board thickness |
0.3-3.5mm |
0.21-6.0mm |
| Minimum line width/space |
0.1/0.1mm |
0.076/0.076mm |
| Minimum line gap |
+/-15% |
+/-10% |
| Outer layer copper thickness |
140um |
245um |
| Inner layer copper thickness |
70um |
245um |
| Min.finished hole size(mechanical) |
0.2mm |
0.15mm |
| Min.finished hole size (laser hole) |
0.1mm |
0.1mm |
| Aspect ratio |
10:01 |
20:01 |
| Solder mask color |
Green、Blue、Black、White、Yellow、Red、Grey |
| Impedance control tolerance |
<=+/-10% |
| Surface Treatment |
Flash gold |
0.025-0.075um |
0.025-0.5um |
| Immersion gold |
0.05-0.1um |
0.1-0.2um |
| Sn/Pb HASL |
1-70um |
| Leadfree HASL |
1-70um |
| Immersion silver |
0.08-0.3um |
| OSP(Entek) |
0.2-0.4um |
| Gold finger |
0.375um |
>=1.75um |
| Hard gold plating |
0.375um |
>=1.75um |
| Immsion Sn |
0.8um |
|
| V-Cut |
|
V-Cut degree |
20,30,45,60 |
| Outline Profile |
Chamfer |
The angle type of the chamfer |
30,45,60 |
| Plug via hole |
Max.size can be plugged |
0.6mm |
0.7mm |
| Largest NPTH hole size |
6.5mm |
>6.5mm |
| Largest PTH hole size |
6.5mm |
>6.5mm |
| Min.annular ring can be kept |
0.15mm |
0.1mm |
| Min.distance between the IC |
0.25mm |
0.18mm |
| pads can keep Sm bridge |
| Min.SM bridge for green soldermask |
0.1mm |
0.076mm |
| Min.SM bridge for black soldermask |
0.125mm |
0.1mm |
| Tolerance of dimension size |
<=+/-0.13mm |
+/-0.1mm |
| Tolerance of board thickness |
>=1.0mm +/-10% |
+/-8% |
| <1.0mm +/-0.1mm |
| Tolerance of finished NPTH hole size |
+/-0.05mm |
+/-0.05mm |
| Tolerance of finished PTH hole size |
+/-0.076mm |
+/-0.05mm |
| Delivery time |
10~12D |
5~7D |
| Capacity |
50000sq/m |